Quectel Launches Full-Feature ARM Motherboards QSM560DR and QSM668SR Series

Quectel, a global leader in IoT solutions, has officially launched two full-feature ARM motherboards – the QSM560DR and QSM668SR series.

As a core platform for smart device development and hardware design, these ARM motherboards offer exceptional integration, high performance, broad compatibility, and a rich set of functional interfaces, effectively meeting the industrial and consumer application demands for robotics, edge computing, wireless communication, and multimedia features. These products will accelerate the adoption of edge intelligent applications and open up new possibilities for their deployment.

QSM560DR Series: Powerful Performance to Drive Smart Edge Industry Development

The Quectel QSM560DR series is a full-feature ARM motherboard developed by Quectel based on Qualcomm’s QCM6490/QCS6490 chip platform. It is equipped with a high-performance octa-core 64-bit processor, Adreno™ 643 high-performance graphics engine (GPU), and 12 TOPS NPU computing power. With robust edge computing capabilities and rich multimedia functionality, it supports operating systems such as Ubuntu, Android, and Linux, as well as multi-system integration. This provides developers with flexible development options.

High Performance of Quectel’s Full-Feature ARM Motherboard QSM560DR Series

In terms of wireless connectivity, the QSM560DR series meets the 3GPP R15 standard, supporting both 5G SA and NSA modes, while also being backward compatible with 4G and 3G networks. Additionally, it integrates Wi-Fi 6E & DBS, Wi-Fi 2×2 MU-MIMO, and Bluetooth 5.2 technologies to ensure stable, high-speed connections in all scenarios. To better meet the positioning needs of terminal devices, the series also integrates a multi-constellation GNSS receiver for fast and accurate location tracking.

The QSM560DR series is feature-rich and can significantly enhance device stability and ease of use. Moreover, to accommodate various application needs, the series integrates numerous functional interfaces, such as USB, Ethernet, RS232, RS485, CAN, and more. It also supports dual-screen display, digital Mic input, audio output, and multiple camera inputs, making it suitable for applications in robotics, smart retail, smart campuses, security monitoring, industrial intelligence, and other edge computing scenarios.

QSM668SR Series: Flexible and Efficient, Accelerating Multi-Scenario Smart Upgrades

The QSM668SR series is another cost-effective full-feature ARM motherboard developed by Quectel, based on Qualcomm’s QCM6125 platform. It features a high-performance octa-core 64-bit processor, integrated Adreno™ 610 GPU, and 1.3 TOPS NPU computing power. The QSM668SR series supports multiple operating systems, offers strong performance, and boasts rich multimedia capabilities, making it a powerful hardware solution for the development of intelligent applications.

High Performance of Quectel’s Full-Feature ARM Motherboard QSM668SR Series

The QSM668SR series also excels in wireless connectivity. It supports LTE Cat 4 networks and is backward compatible with 3G/2G networks, while also supporting Wi-Fi, Bluetooth, and other network protocols to ensure stable and flexible terminal connections. The series also integrates a multi-constellation GNSS receiver, providing fast and precise GNSS positioning functionality for related applications.

To expand the range of possible applications, the QSM668SR series includes a variety of functional interfaces, such as USB, Ethernet, RS232, RS485, CAN, and more, as well as audio and video interfaces. These features enable its widespread use in smart robots, IoT gateways, smart homes, industrial equipment terminals, smart signage, smart cash registers, security detection devices, in-vehicle devices, information collection equipment, vending machines, logistics lockers, and more.

With the rapid development of 5G, edge computing, and other technologies, ARM motherboards with computing power are expected to play a key role in accelerating the deployment of intelligent applications, fostering technological innovation, and promoting industrial upgrades. The release of the QSM560DR and QSM668SR series full-feature ARM motherboards by Quectel demonstrates the company’s strong expertise and innovative capabilities in the field of edge intelligence, while providing developers and customers with more flexible, efficient, and reliable solutions for their products.

Fibocom Launches 5G RedCap MiFi Solution

In November 2024, Fibocom launched a full range of commercial 5G RedCap FWA solutions, covering MiFi, CPE, Dongle, and more, helping global operators and end customers quickly commercialize RedCap.

By reducing transmission bandwidth, trimming the number of transmit and receive antennas, and lowering the maximum modulation order for uplink and downlink, RedCap terminals are less complex compared to eMBB terminals, making them the best choice for mid- and high-speed IoT applications. With continuous product and technology iterations and improvements in RedCap network infrastructure, 5G RedCap modules will continue to achieve a balanced point between performance, cost, and power consumption, enabling terminals to quickly seize the 5G commercial opportunities.

The 5G SA network is the foundational condition for RedCap network construction. Currently, operators around the world are steadily deploying SA networks. According to the latest data from GSA, as of September 2024, 63 out of 343 global operators’ 5G commercial networks have already implemented SA standalone networks.

According to China Mobile’s “5G Lightweight Technology (RedCap) Industry Solution White Paper,” as of the third quarter of 2024, China Mobile has activated over 430,000 5G RedCap base stations, achieving continuous coverage of all county-level areas and above nationwide with n28 (700 MHz) RedCap. It has also launched n41/n79 (2.6 GHz/4.9 GHz) RedCap features as needed. Furthermore, in terms of network performance in continuous coverage areas, RedCap 1T2R terminals on the n28 (700 MHz) network can achieve an uplink average speed of 86 Mbps and a downlink average speed of 105 Mbps. In terms of mobility, RedCap terminals in existing network coverage areas can achieve 5G system interoperability with a latency of 30 ms, and 5G-to-4G system interoperability with a latency of 70 ms.

As seen above, RedCap can meet the requirements of mobile broadband applications like MiFi in terms of mid-to-high speed, continuous network coverage, and smooth 4G/5G handovers, which will accelerate the large-scale adoption of RedCap in MiFi applications.

Fibocom aims at typical FWA application scenarios and provides Fibocom RedCap modules and solutions that offer better cost efficiency than 5G eMBB and lower power consumption than LTE Cat. 4. The RedCap MiFi solution launched this time is equipped with Fibocom FG131 or FG132 series RedCap modules, which can be flexibly paired with various Qualcomm platform Wi-Fi chips, offering Wi-Fi 6E capabilities with up to 3600 Mbps, Wi-Fi 6 with 1800 Mbps, and Wi-Fi 5 with 867 Mbps.

Fibocom’s RedCap modules FG131 & FG132 are based on the Qualcomm Snapdragon X35 5G modem and RF system, supporting peak download speeds of up to 223 Mbps and peak upload speeds of up to 123 Mbps. In the absence of 5G SA network coverage, and when falling back to 4G, the FG131 and FG132 series still support 256QAM downlink with a maximum speed of 195 Mbps, a 33% improvement over LTE Cat. 4. The uplink supports 64QAM, with a maximum speed of 75 Mbps, a 50% improvement over LTE Cat. 4.

In addition to superior cellular capabilities compared to standard RedCap, the Fibocom FG132 & FG131 series also feature two major advantages: they support OpenWRT based on the Linux kernel, with powerful network components that allow customers to flexibly install network function software packages, making them particularly suitable for MiFi, CPE, and other FWA terminal development. Additionally, the FG131 and FG132 series integrate a 1.25 Gbps SGMII interface, allowing efficient expansion to RJ45 wired network ports, making them suitable for MiFi, CPE, and other FWA terminals that require network ports.

Thanks to these multiple advantages, Fibocom’s RedCap modules FG131 & FG132 series offer excellent RedCap capabilities, especially suitable for MiFi, CPE, and other FWA terminals, helping customers make the most of RedCap more quickly.

Fibocom Launches Next-Generation SC636 Series Smart Module

Recently, Fibocom launched the next-generation LTE smart module SC636 series, based on the UNIS UIS7861 platform. The series covers regions such as EAU, CN, and LA, with versions supporting only Wi-Fi and Bluetooth communication. These products meet the long lifecycle requirements of scenarios like smart payment, power monitoring, and industrial handheld devices, offering high-value smart module solutions with strong wireless communication, multimedia processing, and scalability.

High Performance and Stability with a Powerful Core


The SC636 series smart module is built on the UNIS UIS7861 platform, integrating a dual-core ARM Cortex-A75 processor and a six-core ARM Cortex-A55 processor with a clock speed of up to 1.6 GHz. It also includes the Arm Mali™-G57 GPU, further enhancing its image processing capabilities. Thanks to its exceptional chip performance, the SC636 series supports multi-tasking and complex calculations, easily meeting the high-performance demands of payment and industrial handheld terminals.

Support for Diverse Network Standards and Positioning Capabilities


As a 4G smart module supporting multiple network standards, the SC636 series supports LTE Cat.4 networks, covering the mainstream frequency bands of global operators, with a maximum downlink speed of 150 Mbps. It offers extensive network coverage and data transmission capabilities, ensuring that payment and industrial devices can maintain stable connections across various network environments. Additionally, the SC636 series supports dual-band Wi-Fi (2.4 GHz and 5 GHz) and Bluetooth 5.0 short-range communication, providing flexible connectivity options to enhance user experience. The module also integrates a multi-constellation GNSS receiver, supporting GPS, BeiDou, GLONASS, and Galileo positioning systems to ensure fast and accurate location tracking in different environments.

Multimedia Functionality for Expanding Use Cases


To support comprehensive upgrades in multimedia performance for smart terminals, the SC636 series supports a maximum main screen resolution of 25201080 @60fps, with single-camera and dual-camera configurations, as well as the ability to operate up to three cameras simultaneously, delivering a high-definition image and video experience. Furthermore, the SC636 series uses a 40.5mm x 40.5mm LCC+LGA package, integrating a wide range of peripheral interfaces such as MIPI, USB, UART, SPI, and I2C, allowing for the connection of touchscreens and supporting dual-camera functionality. This greatly aids customers in expanding external devices and application scenarios.

The Fibocom SC636 series is equipped with the open Android 12 operating system, with future upgrades planned to support Android 14/16, ensuring long lifecycle, high reliability, and continuous upgrades for stable operations.

Multi-Regional Versions to Drive Smart Industry Upgrades


To meet the customized needs of customers in different regions, the SC636 series offers region-specific versions such as SC636-EAU, SC636-CN, and SC636-LA for Europe, China, and Latin America, respectively. It also provides the SC636-W version, which supports only Wi-Fi and Bluetooth, without cellular connectivity. These solutions provide high performance, low power consumption, and reliable security for smart payment, industrial, and other devices, driving further industry upgrades.

As the number of connected smart devices continues to grow, scenarios like smart retail and smart industry are placing new demands on flexibility, reliability, and long lifecycle for intelligent solutions. Fibocom will continue to provide one-stop AIoT solutions for the smart industry, offering global customers safer, more convenient, and more efficient smart experiences.

New AI Module SIM8965 Launched by SIMCOM

SIMCOM has launched its new generation intelligent module, the SIM8965 series, targeting the Chinese and global markets. This addition enhances its lineup of smart module products. As a globally recognized provider of IoT modules and solutions, SIMCOM’s rich array of smart modules provides robust support for clients in developing edge computing and on-device AI products.

SIMCOM SIM8965 is an LTE Cat.4 intelligent module built on the Qualcomm SM6115 chipset platform, featuring an 8-core 64-bit ARM Kryo260 processor and Adreno™ 610 GPU with a frequency of up to 2.0GHz. In terms of connectivity, the SIM8965 supports LTE Cat.4, with downlink speeds of up to 150Mbps and uplink speeds of up to 50Mbps, and is compatible with global frequency bands, facilitating data communication across various network types including GSM/GPRS/EDGE, WCDMA/HSPA+, LTE-FDD, and LTE-TDD.

Additionally, this SIMCOM LTE module supports Wi-Fi 5 and Bluetooth 5.1 functionalities, and integrates a multi-constellation GNSS receiver supporting multiple satellite positioning systems such as GPS, BeiDou, GLONASS, Galileo, and QZSS, providing robust network connectivity and high-precision positioning capabilities.

The SIMCOM SIM8965 module excels in image processing, supporting dual cameras of 13MP+13MP or 25MP+5MP, and the main screen supports FHD+ (2520*1080) at 60fps, with encoding capabilities for 1080P at 60fps, ensuring smooth playback and high-quality recording of HD video content. In terms of audio, the SIM8965 supports various audio encoding formats and voice codec technologies, delivering a high-quality voice communication experience.

Moreover, the SIM8965 integrates Android OS, Wi-Fi, Bluetooth, and GNSS functionalities into a single module, simplifying system design, reducing development costs, and enhancing system stability and reliability. The SIM8965 is also compatible with SIMCOM’s SIM8918 series, offering high integration and compatibility for customers’ product innovation and upgrade needs.

With a variety of interfaces, the SIM8965 enhances user experience by offering multiple application possibilities. The module is packaged in LCC+LGA with dimensions of 40.5 x 40.5 x 3.0 mm, incorporating rich interfaces such as MIPI_DSI, CSI, UART, SPI, I2C, GPIO, and USB, allowing for connection with cameras, displays, audio, and sensors for multi-dimensional data collection and human-machine interaction. Its strong application potential in facial recognition, voice recognition, and intelligent detection makes it a reliable ally for digital transformation in fields like smart payment, advertising media, smart vehicles, remote diagnostics, and smart industry.

As the Internet of Things and artificial intelligence technologies rapidly evolve, intelligent modules will play an increasingly vital role as the bridge between the physical and digital worlds. SIMCOM’s new SIM8965 intelligent module, with its high performance, high integration, and rich interface design, contributes significantly to the digital transformation of industries. Additionally, the SIM8965 series features a long lifecycle, meeting customer demands for reliability and stability, with both domestic and global frequency versions available to accommodate differentiated customer needs.

In response to the diverse demands for intelligent modules in the Chinese and global markets, SIMCOM is developing different versions of products with varying computing power, packaging forms, and frequency bands tailored for different countries and regions. In the future, based on a comprehensive range of full-standard and multi-matrix product lines, SIMCOM will continue to innovate and develop high-quality products to promote a brighter future for IoT and artificial intelligence technologies.

Fibocom Releases 5G Module FG370-KR for Korean 5G AIoT Market

During the AIoT Korea Exhibition 2024 in Seoul, FIBOCOM announced the launch of its 5G module FG370-KR, providing outstanding 5G solutions for Korea’s 5G AIoT industry and accelerating the large-scale commercial use of 5G in the country.

According to a 2023 report from the Korea Communications Commission, the number of 5G users in South Korea has reached 32.81 million. Furthermore, global consulting firm Omdia predicts that by the end of 2024, the number of 5G users in South Korea will exceed that of 4G, reaching 69 million by 2028. Currently, the South Korean 5G market is leading globally and shows a strong growth trend. The accelerated commercialization of 5G in Korea is not only generating a wealth of industry applications in sectors such as industrial connectivity, healthcare, smart cities, and entertainment, but is also speeding up the deployment of fixed wireless access (FWA) broadband services. The FIBOCOM 5G module FG370-KR is compatible with mainstream 5G frequency bands in Korea, facilitating the rapid deployment of 5G FWA in the market.

The Fibocom FG370-KR is based on the high-performance MediaTek T830 platform, supporting the 3GPP R16 evolution standard. It utilizes a 4nm process technology and features a quad-core Arm Cortex-A55 CPU, delivering a 10% performance improvement over the previous MediaTek T750 platform. Additionally, the T830 integrates hardware-level MediaTek Network Acceleration Engine and Wi-Fi Offload Engine, providing gigabit-level throughput for 5G cellular network transmission to Ethernet or Wi-Fi without increasing CPU load, thus delivering an exceptional network experience. In terms of 5G speed, the FG370-KR includes the M80 5G modem, supporting Sub-6GHz full-band 5G networks, allowing end customers to enjoy a broadband 5G experience. The FG370-KR supports up to 300MHz bandwidth in FDD and TDD mixed modes, with downlink NR 4CA (four-carrier aggregation) and uplink NR 2CA (two-carrier aggregation), offering downlink speeds of up to 7Gbps. For signal coverage, the FG370-KR supports PC2 technology for High Power User Equipment (HPUE), enhancing 5G uplink capabilities and expanding effective coverage.

The Fibocom FG370-KR supports a variety of peripheral interfaces, including three PCI-Express ports, USB 3.2, and two USXGMII interfaces with speeds of up to 10GbE, and can be expanded with PCM/SPI interfaces to support RJ11 phone interfaces. Meanwhile, the FG370-KR also supports diverse storage configurations, efficiently meeting various storage requirements for different applications.

With MediaTek’s 5G UltraSave power-saving technology, the FG370-KR optimizes its operating mode according to the 5G network environment, reducing communication power consumption and significantly enhancing user experience for broadband access products.

Thanks to these hardware and software features, the FG370-KR will continue to deliver enhanced performance, higher speeds, and greater specialization in comprehensive solutions for end customers. FIBOCOM, as a global leader in MBB FWA solutions, will continue to provide innovative products and solutions for the global 5G market, driving the accelerated development of 5G broadband.

Tao Xi, Vice President of the MBB Product Management Department at FIBOCOM, stated:

“In response to the rapidly developing Korean 5G market, FIBOCOM has launched the high-performance 5G module FG370-KR, helping local operators and end customers achieve commercial success in FWA quickly. Based on the MediaTek T830 platform, the FG370-KR combines powerful 5G features, and its exceptional quality will continue to empower smart homes, enterprise office environments, and other intelligent scenarios. In the future, FIBOCOM will keep providing high-value 5G solutions across various application fields.”

Quectel RG255C-GL 5G RedCap Module Successfully Passes Global Certifications

Recently, Quectel’s 5G RedCap module RG255C-GL has successfully passed multiple international certifications for the global market, including GCF global certification, North American FCC, IC, PTCRB certifications, European CE certification, and Australian RCM certification.

This means the Quectel RG255C-GL RedCap module is now fully commercially available and meets the stringent requirements for RedCap network connectivity in markets such as Europe, North America, and Australia. With balanced technical performance, this product provides stable and reliable connectivity support for IoT terminals like CPEs, MiFis, routers, gateways, locators, and industrial PDAs.

RedCap, a lightweight IoT technology derived from 5G NR, achieves cost optimization, size reduction, and lower power consumption by streamlining device capabilities and complexity. Meanwhile, RedCap retains important 5G native features, such as low latency, high reliability, and support for functions like 5G slicing and 5G LAN, making it highly suitable for the digital transformation needs of vertical industries.

Powerful Core, Achieving All-Around Excellence

The Quectel RG255C-GL module is based on the Qualcomm Snapdragon® X35 platform, designed for the global market, and widely compatible with major operators. It complies with the 3GPP R17 standard, supports 5G Sub-6 standalone (SA) mode and LTE Cat 4 networks, and is compatible with Rel-15 (SA) and Rel-16 (SA) networks, meeting the seamless integration and flexible deployment needs of terminal devices. The module also supports low-latency communication and key 5G features such as 5G LAN, uRLLC, and network slicing.

The RG255C-GL achieves a downlink speed of up to 223 Mbps and a peak uplink speed of 123 Mbps, suitable for entry-level FWA applications, video transmission, and mid-to-high-speed IoT requirements.

Additionally, the Quectel RG255C-GL supports the OpenWrt operating system, providing router customers with a wide range of flexible development options. This module also integrates Qualcomm® IZat™ positioning technology, supporting GPS, GLONASS, BDS, Galileo, and NavIC positioning technologies for faster, more precise, and reliable enhanced positioning services.

Compact Design, Demonstrating Exceptional Strength

Not only is the  5G Module powerful in performance, but it also features a sleek and compact design. It uses a compact LGA package, measuring only 32.0 mm × 29.0 mm × 2.4 mm, consistent in size with Quectel’s classic LTE Cat 4 module EG2x series, significantly simplifying the upgrade process for 4G devices, effectively shortening development cycles and reducing costs.

Moreover, the RG255C-GL integrates a rich set of interfaces, including USB 2.0, PCIe 2.0, PCM, UART, SGMII, and SPI, supporting various drivers and software functionalities, expanding its wide-ranging applications in the RedCap field.

In addition, this Quectel 5G module can be paired with various antennas from Quectel, allowing terminal customers to choose compatible antennas based on actual needs, thus reducing costs and accelerating product time-to-market.

Quectel’s 5G-A RG650V Module Passes GCF/PTCRB Certification

Recently, Quectel, a leading global IoT solution provider, announced that its new 5G-A series module RG650V has become the first product based on Qualcomm’s Snapdragon X72 platform to successfully pass GCF/PTCRB certification.

The passing of these two certifications indicates that the Quectel RG650V meets the relevant regulations and standards for regions such as North America, achieving a secure and stable compatibility status with major operators in those regions, providing users with efficient and reliable 5G communication services. Notably, the RG650V has also passed the US FCC certification.

Consistency certification is a key step in bringing IoT devices to market. PTCRB certification focuses on device compatibility and performance on North American operator networks, while GCF is an international product consistency certification. Together, they provide dual assurance for compliant sales of wireless communication devices in key global markets. The RG650V, as the first module based on the Snapdragon X72 platform to pass both certifications, further demonstrates the leading edge of Quectel 5G modules and the company’s overall strength.

Developed on the world’s first 5G Advanced-ready modem and RF system—the Qualcomm Snapdragon X72—the RG650V employs 3GPP Rel-17 technology, supporting 5G NSA and SA modes, as well as Option 3x, 3a, 3, and Option 2 network architectures. It also supports extended 8Rx frequency bands and DL 4 × 4 MIMO technology to enhance 5G network coverage, transmission efficiency, and user experience. Additionally, the series is backward compatible with 4G/3G and supports the latest Wi-Fi 7 technology, introducing up to 4K QAM modulation and 2.4/5/6 GHz Wi-Fi, ensuring stable operation even in areas lacking 5G deployment.

For high-precision positioning applications, the RG650V series incorporates Qualcomm’s advanced IZat™ positioning technology (Gen 9VT) and an optional multi-constellation GNSS receiver, supporting GPS, GLONASS, BDS, Galileo, and QZSS positioning technologies. This enables faster, more accurate, and reliable positioning while simplifying product design and allowing for real-time adjustments based on terminal needs.

To expand the RG650V series’ application possibilities, the module features a range of industrial-standard interfaces, including USB 2.0/3.0/3.1, PCIe 3.0, PCM, and UART. It also comes with the OpenWrt operating system, offering broad and flexible development options for router customers. The series includes RG650V-EU and RG650V-NA versions to meet different regional requirements.

In recent years, the deep integration of 5G with AR/VR, ultra-high-definition video, big data, cloud computing, and the metaverse has driven innovation in 5G applications, creating new business models and experiences. At the same time, new industries present new network connection demands, making 5G-A a timely solution. The new 5G-A module RG650V series from Quectel not only stands out in terms of timeliness and leadership but also excels in performance, supporting the comprehensive upgrade of the communications industry chain and driving rapid digitalization across various sectors.

SIMCOM Cat.1 Module SIM7670G Acquires 10 Major Global Certifications

Recently, SIMCOM’s LTE Cat.1 module SIM7670G has successfully obtained certifications from PTCRB, IC, AT&T, and T-Mobile. With this, the module now holds 10 major global certifications, including CE, FCC, GCF, KC, ROHS & REACH, TELEC, and JATE. This signifies that the SIM7670G meets performance standards across various regional markets, including Asia, Europe, North America, and South America, supporting stable and efficient Cat.1 terminal operations locally and helping customers rapidly enter the global market.

As a key model in SIMCOM’s LTE Cat.1 series, the SIM7670G is developed based on the Qualcomm QCX216 platform and supports LTE-FDD/LTE-TDD communication modes, with uplink speeds up to 5Mbps and downlink speeds up to 10Mbps. The SIMCOM LTE Cat.1 Module adapts to various network frequency bands globally. The module features SIMCOM’s classic 24242.4mm LCC+LGA packaging, making it compact and easy to integrate into small IoT devices, saving space.

The SIMCOM SIM7670G also boasts strong compatibility, matching the shape of SIMCOM’s Cat.1 module A7670C, NB/Cat.M modules SIM7000, SIM7070 series, and 2G modules SIM800 series, easing the transition from 2G and NB/Cat.M products to LTE Cat.1. It includes various network protocols and USB drivers for the three major operating systems (Windows, Linux, Android), and its software functions and AT commands are compatible with the A7670C series, simplifying development and cost.

In terms of power management, the SIM7670G excels with deep sleep (DRX) technology, adjusting power levels based on network conditions and application needs. With DRX parameters set to 0.64 seconds, the module’s power consumption is as low as 230uA, maintaining a low-power sleep state for most of the time and briefly waking every 0.64 seconds for network monitoring or essential tasks. This precise power management extends device battery life, particularly in IoT applications where long-term operation with limited power changes is required.

Additionally, the SIM7670G integrates a rich set of industrial-standard interfaces, including UART, USB, I2C, and GPIO, offering flexibility for customer configuration. It is widely applicable in remote information processing, metering, monitoring devices, industrial routers, and remote diagnostics. The module also includes a multi-constellation GNSS receiver supporting GPS, Beidou, GLONASS, Galileo, meeting terminal device location needs.

Since its release, the SIM7670G has been recognized for its high compatibility, high integration, low power consumption, and small size, and has been popular in mid-to-low-speed applications. The anticipated North American operator certifications have been successfully completed with AT&T and T-Mobile, and Verizon certification is in the final stages.

Looking ahead, SIMCOM will continue to develop and release more full-form modules to meet global and industry-specific demands, complete with comprehensive certification systems, contributing to the digital transformation of industries and laying a solid foundation for customers to expand into global markets.

Quectel’s High-End 5G Smart Module SG560D-NA First to Receive PTCRB Certification

Recently, Quectel announced that its high-end 5G Smart module SG560D-NA, based on the Qualcomm QCM6490 platform, has successfully received PTCRB certification. Prior to this, the module also obtained certifications from the US FCC and Canada’s IC, indicating that it fully meets the standards and regulations for North America. This ensures efficient and stable operation of related smart devices in the region, aiding customers in rapidly expanding into the North American market.

High-End 5G Performance Leader

The Quectel SG560D-NA, developed on the Qualcomm QCM6490 platform, features a high-performance octa-core 64-bit processor and an integrated Qualcomm Adreno™ 643 GPU (high-performance graphics engine), with a combined computing power of up to 14 TOPS. It offers efficient edge computing capabilities and rich multimedia features. Thanks to the dedicated NPU of the Qualcomm QCM6490 platform, the module achieves an optimal balance between performance and power consumption.

As an intelligent module product integrating 5G and edge computing capabilities, the SG560D-NA also boasts excellent wireless performance. It complies with the 3GPP R15 standard, supports both 5G NSA and SA modes, and is backward compatible with 4G/3G networks, providing comprehensive coverage of various network types. It supports 5G & LTE multiple-input multiple-output (MIMO) technology, delivering high-speed, stable, and ubiquitous cellular connectivity to end devices.

Moreover, the SG560D-NA supports Wi-Fi 6E & DBS, IEEE 802.11a/b/g/n/ac/ax, Wi-Fi 2 × 2 MU-MIMO, and Bluetooth 5.2 technology, further diversifying wireless connection options and significantly enhancing data transfer efficiency and reliability.

Additionally, the module integrates a multi-constellation GNSS receiver, supporting GPS, GLONASS, BDS, NavIC, Galileo, QZSS, and SBAS positioning systems, and supports dual-frequency positioning, effectively meeting the positioning needs of end devices.

Smart and Flexible, Widely Applicable

The SG560D series runs on Android 13 and can be upgraded to Android 14/15 in the future. It also supports Windows, Linux, Ubuntu, and other operating systems, providing a broad range of options for various edge intelligent applications through its “one module, four systems” approach. This flexibility caters to the diverse needs of different industries and application scenarios.

The Quectel 5G Smart module features robust multimedia capabilities, with its built-in Adreno™ 643 GPU and 12 TOPS NPU power, facilitating quick and high-quality graphics rendering. Coupled with 4K H.265/H.264 video encoding and decoding capabilities, it delivers a smoother experience for multimedia-intensive scenarios.

Additionally, the SG560D-NA offers a range of functional interfaces such as LCM, camera, touchscreen, PCIe, UART, USB, I2C, and I2S, greatly expanding its application scope in the smart IoT field. It can be used in various domains including smart cash registers, intelligent robots, edge computing terminals, vending machines, facial payment terminals, smart gateways, CPE, MiFi, MID, PND, POS, routers, digital billboards, industrial PDAs, and smart security.

Furthermore, to accelerate the deployment of intelligent applications, Quectel provides a series of matching antenna products to help customers simplify terminal design and shorten product time-to-market.

In addition to the completed PTCRB, FCC, and IC certifications, the SG560D-NA is also undergoing certification with AT&T, Verizon, and T-Mobile. Moving forward, the module will continue to leverage its advantages in connectivity, edge computing, multimedia performance, and multi-system support to contribute further to intelligent development across more regions and industries.

Here now the Quectel QSM560DR 5G Smart Board based on Quectel SG560D module for industrial application is available here： https://www.4gltemall.com/quectel-qsm560dr-5g-smart-control-board.html .

SIMCom’s Comprehensive Modules Unveiled at IOTE 2024

From August 28-30, the 22nd International Internet of Things Exhibition (IOTE 2024) grandly opened at the Shenzhen International Convention and Exhibition Center. SIMCom showcased a range of products, including 5G, smart, LTE-A, 4G, LPWA, and GNSS modules, along with application terminals. The exhibit richly demonstrated SIMCom’s solutions and application cases in various scenarios such as industrial IoT, smart cities, smart energy, smart homes, smart healthcare, vehicle networking, and smart agriculture.

IOTE Gold Award Honors, Leading 5G Innovation

During the exhibition, the results of the IOTE Gold Award annual selection were officially announced. SIMCom’s 5G-A module SIM8390 won the “IOTE Gold Award” for innovative products. This accolade further highlights SIMCom’s achievements in the 5G domain, accelerating the empowerment of “high-speed” scenario needs and promoting digital transformation across industries with the help of 5G.

The SIMCOM SIM8390 supports Sub-6GHz and mmWave frequency bands. It offers a downlink speed of up to 10Gbps and an uplink speed of 3.7Gbps in the mmWave band, and in the Sub-6GHz band, it supports downlink speeds of 8Gbps and uplink speeds of 1Gbps, providing “10G downlink and 1G uplink” data transmission capabilities.

5G RedCap Shines at the Exhibition

As one of the cornerstones of 5G-A, 5G RedCap also shone brightly at the exhibition. SIMCom presented the SIM8230 series of 5G RedCap modules, available in LGA+LCC and M.2 packaging forms. These modules are equipped with Qualcomm’s X35 5G modem and RF system, offering peak download speeds of up to 220Mbps and uplink speeds of up to 100Mbps, meeting high-speed transmission requirements. They support VoNR and VoLTE, and integrate dual-frequency GNSS L1+L5 for precise positioning, making them suitable for high-speed scenarios such as FWA, smart wearables, and low-altitude economy.

In addition to 5G RedCap, SIMCom also showcased several popular 5G module products, including the SIM8202, R8200C, SIM8260, and the 5G/LTE+C-V2X module SIM8800. These modules are applicable to CPE, MiFi, ODU, IDU, Box, and other terminals, providing high-speed connectivity for enterprises, homes, and industrial scenarios. With various packaging forms and models covering different regions, these modules offer flexible product choices to help customers quickly enter target markets.

AI Capabilities on Display, Accelerating Smart Connectivity

In the AI era, computing power is the new productive force. At the exhibition, SIMCom showcased several intelligent modules with integrated AI algorithms, including SIM8918, SIM8906, SIM8905, SIM8971, SIM8973, SIM8970, SIM8950, SIM9650L, and SIM9650L-W. These modules cover different levels of computing power, frequency bands, regions, packaging forms, and sizes. They not only support efficient data transmission and processing but also include graphic processors for real-time analysis of massive graphics and video data, providing robust support for intelligent transformation across various industries.

Two high-performance intelligent modules, SIM9650L and SIM9650L-W, drew significant attention from visitors. With a combined computing power of up to 14 Tops, they support Wi-Fi 6E and Bluetooth 5.2 connections, and integrate SLAM algorithms, making them ideal for VR, intelligent robotics, low-altitude economy, and other scenarios requiring high-quality image and video input and the processing of large amounts of data and tasks.

LTE-A Ultra-Speed Experience, 4G Smart Connectivity

Despite the rise of 5G, LTE-A still maintains a significant market presence due to its compatibility and cost advantages. SIMCom’s LTE Cat.6 module SIM7906 and LTE Cat.12 module SIM7912 series achieve a balance between performance, speed, and cost, meeting the needs of various LTE-A application scenarios.

Additionally, the LTE Cat.1 module SIM7670G, suitable for remote information processing, metering, monitoring devices, industrial routers, and remote diagnostics, as well as the LTE Cat.4 automotive-grade modules SIM7800, SIM7805, and SIM7600 series for vehicle networking scenarios, were also featured. These modules cover frequency band requirements in Asia, Europe, South America, and North America, providing customers with more options and supporting the rapid development of vehicle networking and industrial IoT.

LPWA Green Engine, GNSS for the Future

Facing dual challenges of energy and environment, the application of low-power devices is crucial. SIMCom’s LPWA series modules, with their low power consumption and wide coverage features, contribute to the digital development of smart energy and water services.

The exhibition featured not only modules such as SIM7070G, SIM7070G-HP-S, SIM7080, Y7080E, SIM7022, SIM7000G, SIM7090G, and R7022 but also intelligent gas meters and ultrasonic water meters equipped with E7025-L and Y7025. These contribute to achieving green, low-carbon, and sustainable development in the energy sector.

Furthermore, SIMCom’s entire range of low-power, compact GNSS modules was also displayed, covering standard and high-precision needs and compatible with mainstream market sizes. These modules are suitable for applications such as autonomous driving, container monitoring, and smart agriculture. Among them, the SIM66D (-R) stands out as an indispensable new star for high-precision positioning applications due to its ultra-low power consumption, centimeter-level positioning, multi-system support, and compact size.